ADVANCED IC PACKAGING TECHNOLOGIES

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ADVANCED IC PACKAGING TECHNOLOGIES

The many different functions of semiconductor devices are made possible by integrated circuits, which are built into the surface of a silicon chip (bear chip) using a complex process. If these chips could be used in unmodified form, packaging would be unnecessary, and the cost of chips reduced. However, because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat these problems, silicon chips are protected by packaging. There are many different technologies used for packaging components on printed circuit boards. The conventional through –hole technology has now being replaced by a new technology known as Surface Mount Technology (SMT). Surface Mount Technology is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs).Electronic devices so made are called Surface Mount Devices (SMDs). Various other technologies like Ball Grid Array(BGA),Flip-Chip technology, Chip-scale technology,Multichip modules are also emerging which are supposed to take over the existing packaging technologies and are can clearly be defined as future technologies in the field of IC packaging.